Description:
The 839-800327-315 is a 300 mm electrostatic chuck (ESC) manufactured by Lam Research Corporation for the 2300 series etch platform. It is not a control module or a drive — it is the ceramic wafer-clamping and lower-electrode assembly that sits in the process chamber and holds the wafer during plasma etch.
The unit is a bipolar ceramic chuck built for 12-inch (300 mm) wafers, described in trade listings as “12” CER, BI, IMB Big pin” — ceramic dielectric, bipolar electrode, embedded big-pin configuration. It is traded interchangeably under the alternate number 715-800327-315, and it belongs to a revision family that includes 839-800327-385, 839-800327-432 and 839-800327-562, so confirming the suffix against your chamber’s service documentation matters before ordering. The assembly weighs approximately 7.25 kg and is out of OEM production, supplied today as new surplus, tested used, or professionally reworked.
Application Scenarios:
A fab running a fleet of Lam 2300 Exelan dielectric etch chambers on oxide and low-k interconnect processes started seeing a pattern that no single alarm could explain. Helium backside leak rate was climbing slowly, dechuck time had stretched from well under a second to several seconds, and edge critical-dimension uniformity was widening by a nanometre or two each quarter.
What made this expensive was the ambiguity. A rising helium leak looks like a gas-stick or MFC problem. Lengthening dechuck time looks like an ESC power supply fault. Rising particle counts look like a chamber-clean issue. Teams chase the wrong subsystem for weeks, and because a replacement ESC for a legacy 2300 platform carries a lead time measured in months, the interim cost is a chamber running at reduced availability or drifting out of specification.
The root cause was the 839-800327-315 itself: fluorine plasma erosion of the ceramic surface, wear of the mesas that stand the wafer off the dielectric face, loss of flatness on the helium sealing lands, and ageing of the bond layers between ceramic, heater and cooled base plate. Replacing the 839-800327-315 addressed all four failure mechanisms in one intervention, restoring wafer flatness, helium sealing, clamping force and particle performance simultaneously — and returning three ambiguous symptoms to baseline in a single maintenance window.
The same scenario repeats across 2300 Versys Kiyo conductor etch, Versys Metal and Flex chambers: the ESC is the one component whose gradual degradation masquerades as a gas, power or clean problem.
Parameter:
| Main Parameters | Value/Description |
|---|---|
| Product Model | 839-800327-315 (alternate / cross-reference: 715-800327-315) |
| Manufacturer | Lam Research Corporation (LRCX), Fremont, California, USA |
| Product Category | Electrostatic chuck (ESC) assembly — wafer clamping device and chamber lower electrode |
| Host Platform | Lam 2300 series etch systems (Exelan / Exelan Flex dielectric, Versys Kiyo conductor, Versys Metal, Flex) |
| Wafer Size | 300 mm / 12 inch — the single hardest constraint; not interchangeable with 200 mm chucks |
| Chuck Type | Bipolar, ceramic dielectric, embedded big pin (trade description: 12″ CER, BI, IMB Big pin) |
| Dielectric Material | Sintered ceramic — alumina or aluminium nitride depending on revision; confirm against chamber service documentation |
| Clamping Principle | Electrostatic attraction across the ceramic dielectric; Coulomb or Johnsen-Rahbek depending on dielectric resistivity — revision dependent |
| Backside Thermal Control | Helium backside cooling via gas distribution grooves, embossed mesas and an outer seal band |
| Process Application | Dry plasma etch — dielectric, oxide, low-k, polysilicon and metal films |
| Typical Service Interval | ESC replacement commonly scheduled at 400k–600k wafers, adjusted to site PM protocol and process conditions |
| Approximate Weight | 7.25 kg |
| Revision Family | 839-800327-385, 839-800327-432, 839-800327-562 and related 839-800328-xxx variants |
| Service Status | Out of OEM production; supplied as new surplus, tested used, or professionally reworked |