Technical Specifications
| Parameter Name | Value |
|---|---|
| Product Model | Applied Materials 0040-00555 |
| Manufacturer | Applied Materials (AMAT) |
| Product Type | Process Chamber Shield Assembly / Chamber Protection Component |
| Compatible Platforms | AMAT Endura PVD, Centura CVD, Producer Etch |
| Wafer Compatibility | 200 mm / 300 mm Platforms |
| Compatible Processes | Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), Plasma Etching |
| Material | Semiconductor-grade High-Purity Alloy / Corrosion-Resistant Alloy |
| Operating Environment | High-Vacuum (≤ 1×10⁻⁵ Pa typical), High-Temperature, Reactive Plasma Atmosphere |
| Primary Function | Sacrificial Barrier; Captures Sputtered Particles & Reaction Byproducts; Plasma Boundary Stabilization |
| Protected Chamber Hardware | Chamber Wall, Heater Assemblies, Electrode Structures, Gas Distribution Components |
| Installation Method | In-Chamber Embedded Mounting with Alignment & Clamping Structure |
| Maintenance Regimen | Periodic Inspection, Precision Cleaning, or Replacement at End-of-Life |
| Cleanroom Compatibility | ISO 6 Class 1 Cleanroom Compatible |
Main Features and Advantages
Sacrificial protection for critical chamber hardware: The Applied Materials 0040-00555 functions as a consumable barrier that absorbs the destructive energy of plasma and captures reactive byproducts, preventing erosion and particle shedding that would otherwise damage expensive permanent chamber components. By concentrating wear on the replaceable AMAT 0040-00555, fabs can avoid costly chamber overhauls requiring extensive downtime, significantly reducing total cost of ownership . This sacrificial design ensures that process conditions remain stable over extended production runs, which is critical for maintaining consistent etch rates, deposition uniformity, and ultimately, wafer yield .
Superior material performance for demanding environments: Manufactured from high-grade corrosion-resistant alloy or refractory metal, the Applied Materials 0040-00555 delivers exceptional durability in the challenging conditions of high-vacuum, high-temperature, and chemically reactive plasma atmospheres . The material selection minimizes particle generation and maintains dimensional stability under repeated thermal cycling, ensuring the AMAT 0040-00555 provides reliable protection throughout its service life. Its cleanroom compatibility meets ISO 6 Class 1 standards, making it suitable for the most contamination-sensitive semiconductor processes .
Process stability and plasma control: Beyond simple physical protection, the Applied Materials 0040-00555 is geometrically optimized to define and stabilize the plasma boundary within the chamber, contributing to uniform ion distribution and consistent process performance from wafer to wafer . This function is particularly vital in PVD and CVD applications, where the AMAT 0040-00555 localizes excess deposition, protects vacuum integrity, and prevents unwanted film buildup that would otherwise become a primary source of particle defects .
